Manufacturing
In our manufacturing department, thanks to our state-of-the-art assembly machines and automated manufacturing processes, we are in an ideal position to manufacture your products in top quality “Made in Germany”: from the prototype up to large series. Our electronics manufacturing department offers many key technologies in order to be able to manufacture your products so they are well equipped for the future. We put new manufacturing methods on the test bench for you and regularly invest in our machinery.
SMT manufacturing
Inline SMD assembly
3D soldering paste inspection (SPI)
Component housing 0201 – µBGA, BGA, QFN, Finepitch
Reflow soldering under nitrogen
Automated optical inspection (AOI)
THT manufacturing
Automated PCB-depaneling
Through hole assembly
Inline wave and selective soldering
Robot soldering
Lead solder and compliant with ROHS
Press-fit technology
Visual inspection
Electronic protection
Module cleaning
Coating
Potting
Assembly
Glueing of components
Partial and full assembly
Customer-specific assembly clusters
Hot sealing of housings
Ultrasonic welding
Customer-specific final packaging
Including software and operating instructions
Test
In-house testing specifications and test instrument development
Customer-specific functional test
In-circuit test (ICT)
Flying probe test
High voltage test
Climate test
Contact us now at info@nap-tec.de or call us on +49 7231-42909-0