SMT manufacturing
This is where electronics manufacturing is created at the highest level – precise, efficient, and ready for your next ideas.
Our SMT line offers inline SMD assembly with continuous quality monitoring and stands for high cycle rates and reproducible quality – backed by 3D solder paste inspection (SPI) directly in the process.
We process a wide range of component types from 0201 and fine pitch through to QFN, BGA and µBGA.
For hybrid designs, we reliably support pin-in-paste with robust, process-safe execution. Our X-ray component counter ensures transparency in material flow and accurate inventory.
Nitrogen reflow soldering ensures reliable solder joints for complex layouts. Finally, Automated Optical Inspection (AOI) checks every board for quality and dimensional accuracy. Result: production-ready SMT manufacturing with maximum process reliability – from prototype to high-volume production.
Inline SMD assembly
3D solder paste inspection (SPI)
Component types 01005 – µBGA, BGA, QFN, fine pitch
(L x W = 66 x 50 mm; component height up to 25 mm)
Pin-in-paste
X-ray component counter
Nitrogen reflow soldering
Automated Optical Inspection (AOI)
Coming soon:
Inline laser marking
Additional placement portal